Microfluidic device for triggered chip transience

This paper presents the fabrication and testing of a microfluidic device for the triggered destruction (transience) of microchips. The device consists of a thin film array of sealed reservoirs patterned on a polymer film. Each reservoir encloses a corrosive chemical agent which upon release dissolves the surface of a microchip placed beneath. When transience is activated, an integrated micro-heater melts the bottom of the reservoirs thus releasing the chemical agent, which in a matter of minutes destroys key layers on the underlying electronic/sensor chip. Each reservoir consists of a 16 μm-tall cavity holding 1 μL/cm2 of 1000:1 BHF. The measured energy required to burst open a filled reservoir was ~35mJ/cm2 when the device rests on top of a glass substrate and ~100mJ/cm2 when the device rests on top of a 0.5 μm-layer of silicon dioxide on a 0.5 mm silicon wafer.

[1]  Norihisa Miki,et al.  MEMS-based hydraulic displacement amplification mechanism with completely encapsulated liquid , 2011 .

[2]  W. Lou,et al.  Simulation research on a novel micro-fluidic self-destruct device for microchips , 2010, 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems.

[3]  Nguyen Binh-Khiem,et al.  Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors , 2010, Sensors.

[4]  Ellis Meng,et al.  Liquid Encapsulation in Parylene Microstructures Using Integrated Annular-Plate Stiction Valves , 2011, Micromachines.

[5]  K. R. Williams,et al.  Etch rates for micromachining processing-Part II , 2003 .

[6]  Y. Tai,et al.  A Parylene micro check valve , 1999 .

[7]  A. Folch.  Introduction to BioMEMS , 2012 .

[8]  Liwei Lin,et al.  Frozen water for MEMS fabrication and packaging applications , 2003, The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE.

[9]  M. Cima,et al.  A controlled-release microchip , 1999, Nature.

[10]  Nguyen Binh-Khiem,et al.  Polymer thin film deposited on liquid for varifocal encapsulated liquid lenses , 2008 .

[11]  Carlos H. Mastrangelo,et al.  Microfluidic plastic capillaries on silicon substrates: a new inexpensive technology for bioanalysis chips , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.

[12]  Carlos H. Mastrangelo,et al.  Electrophoresis system with integrated on-chip fluorescence detection , 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).

[13]  Norihisa Miki,et al.  Characterization of a bonding-in-liquid technique for liquid encapsulation into MEMS devices , 2010 .

[14]  S. Matsumoto,et al.  New methods for liquid encapsulation in polymer MEMS structures , 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.

[15]  Characterization of water vapor permeation through thin film Parylene C , 2009, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.