Material Classification for Printed Circuit Boards by Spectral Imaging System

This paper presents an approach to a reliable material classification for printed circuit boards (PCBs) by constructing a spectral imaging system. The system works in the whole spectral range [400-700nm] and the high spectral resolution. An algorithm is presented for effectively classifying the surface material on each pixel point into several elements such as substrate, metal, resist, footprint, and paint, based on the surface-spectral reflectance estimated from the spectral imaging data. The proposed approach is an incorporation of spectral reflectance estimation, spectral feature extraction, and image segmentation processes for material classification of raw PCBs. The performance of the proposed method is compared with other methods using the RGB-reflectance based algorithm, the k-means algorithm and the normalized cut algorithm. The experimental results show the superiority of our method in accuracy and computational cost.

[1]  David G. Stork,et al.  Pattern Classification , 1973 .

[2]  Jitendra Malik,et al.  Normalized Cuts and Image Segmentation , 2000, IEEE Trans. Pattern Anal. Mach. Intell..

[3]  Shoji Tominaga,et al.  Reflectance-based material classification for printed circuit boards , 2003, 12th International Conference on Image Analysis and Processing, 2003.Proceedings..

[4]  Du-Ming Tsai,et al.  An eigenvalue-based similarity measure and its application in defect detection , 2005, Image Vis. Comput..

[5]  Shoji Tominaga,et al.  Surface Identification Using the Dichromatic Reflection Model , 1991, IEEE Trans. Pattern Anal. Mach. Intell..

[6]  Pei-Chann Chang,et al.  A case-based evolutionary model for defect classification of printed circuit board images , 2008, J. Intell. Manuf..

[7]  Syed Abdul Rahman Abu Bakar Al-Attas,et al.  Wavelet-based printed circuit board inspection algorithm , 2005, Integr. Comput. Aided Eng..

[8]  Kuo-Sheng Cheng,et al.  Contour-Based Window Extraction Algorithm for Bare Printed Circuit Board Inspection , 2005, IEICE Trans. Inf. Syst..

[9]  Shoji Tominaga,et al.  Material Identification Via Multi-Spectral Imaging and Its Application to Circuit Boards , 2002, International Conference on Communications in Computing.