论文信息 - Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

System-in-package provides highly integrated packaging with high-speed performance. Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds. In a high-frequency spectrum, these wire bonds can cause discontinuities causing signal degradation. This article addresses problems with wire bonding in high-frequency SiP packages and proposes design methodologies to reduce these discontinuities

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