Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
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T. Gessner | H. Vogt | F. Naumann | Ralf Doring | A. Goehlich | H. Kappert | M. Ihle | S. Ziesche | A. Otto | F. Gabler | F. Roscher | Y. Celik | D. Dietz
[1] Joerg Bagdahn,et al. Strength assessment of wafer-bonded micromechanical components using the micro-chevron test , 2001, SPIE MOEMS-MEMS.
[2] Stephen J. Finney,et al. Digital and Analogue Integrated Circuits in Silicon Carbide for High Temperature Operation , 2012 .
[3] F. Roscher,et al. Investigations of thermocompression bonding with thin metal layers , 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
[4] H. Kappert,et al. High-Temperature Trench Capacitors, Using Thin-Film ALD Dielectrics , 2015 .