An Experimental Study on the Design of Miniature Heat Sinks for Forced Convection Air Cooling

An experimental study is performed on one of the smallest commercially available miniature fans, suitable for cooling portable electronic devices, used in conjunction with both finned and finless heat sinks of equal exterior dimensions. The maximum overall footprint area of the cooling solution is 534 mm 2 with a profile height of 5 mm. Previous analysis has shown that due to fan exit angle, flow does not enter the heat sinks parallel to the fins or bounding walls. This results in a nonuniform flow rate within the channels of the finned and finless heat sinks along with impingement of the flow at the entrance giving rise to large entrance pressure losses. In this paper straightening diffusers were attached at the exit of the fan, which resulted in aligning the flow entering the heat sinks with the fins and channel walls. Detailed velocity measurements were obtained using particle image velocimetry, which provided a further insight into the physics of the flow in such miniature geometries and in designing the straightening diffusers. The thermal analysis results indicate that the cooling power of the solution is increased by up to 20% through the introduction of a diffuser, hence demonstrating the need for integrated fan and heat sink design of low profile applications.

[1]  S. J. Kline,et al.  Describing Uncertainties in Single-Sample Experiments , 1953 .

[2]  L. Burmeister Convective heat transfer , 1983 .

[3]  G. Ellison Thermal computations for electronic equipment , 1984 .

[4]  M. R. Vogel Liquid cooling performance for a 3-D multichip module and miniature heat sink , 1995 .

[5]  Frank P. Bleier Fan Handbook: Selection, Application, and Design , 1997 .

[6]  Heng-Chieh Chien,et al.  The study of micro-fin heat sinks for electronic cooling applications , 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

[7]  Markus Raffel,et al.  Particle Image Velocimetry: A Practical Guide , 2002 .

[8]  J. G. Maveety,et al.  Heat transfer from square pin-fin heat sinks using air impingement cooling , 2002 .

[9]  James C. McDaniel,et al.  Effect of Reynolds Number on Performance of a Small Centrifugal Pump , 2003 .

[10]  Monique Lallemand,et al.  Experimental study on silicon micro-heat pipe arrays , 2004 .

[11]  F. L. Tan,et al.  Cooling of mobile electronic devices using phase change materials , 2004 .

[12]  Mark Davies,et al.  Effect of Geometric Scaling on Aerodynamic Performance , 2005 .

[13]  Patrick A. Walsh,et al.  On the Characterisation of Finned and Finless Heat Sinks for Portable Electronics , 2007 .

[14]  Ronan Grimes,et al.  Low profile fan and heat sink thermal management solution for portable applications , 2007 .

[15]  J. Punch,et al.  Acoustic emissions from active cooling solutions for portable devices , 2009, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[16]  Ronan Grimes,et al.  Thermal Management of Low Profile Electronic Equipment Using Radial Fans and Heat Sinks , 2008 .

[17]  E. Walsh,et al.  Acoustic Emissions From Active Cooling Solutions for Portable Devices , 2009, IEEE Transactions on Components and Packaging Technologies.

[18]  E. Walsh,et al.  Profile Scaling of Miniature Centrifugal Fans , 2009 .

[19]  Ronan Grimes,et al.  Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins , 2009 .