Bumpless Build Cube (BBCube): High-Parallelism, High-Heat-Dissipation and Low-Power Stacked Memory Using Wafer-Level 3D Integration Process

The superior electrical performance of 3D integration (3DI) with bumpless wafer-on-wafer (WOW) was clarified by 3D electromagnetic (EM) field analysis. We propose a high parallelism stacked memory, named “BBCube”, using WOW. In comparison with conventional high-bandwidth memory (HBM), BBCube can achieve a bandwidth four-times higher, at 1.4 TB/s, with only 13 % of the I/O power consumption, at 0.29 W. Furthermore, it should have sufficient potential to realize 32-times higher bandwidth and four-times more stacking levels.

[1]  Jin-Hee Cho,et al.  A 1.2V 64Gb 341GB/S HBM2 stacked DRAM with spiral point-to-point TSV structure and improved bank group data control , 2018, 2018 IEEE International Solid - State Circuits Conference - (ISSCC).

[2]  T. Ohba,et al.  Optimization of Via Bottom Cleaning for Bumpless Interconnects and Wafer-on-Wafer (WOW) Integration , 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

[3]  T. Ohba,et al.  Thinned wafer multi-stack 3DI technology , 2010 .

[4]  Jaejin Lee,et al.  An exact measurement and repair circuit of TSV connections for 128GB/s high-bandwidth memory(HBM) stacked DRAM , 2014, 2014 Symposium on VLSI Circuits Digest of Technical Papers.

[5]  Takayuki Ohba,et al.  A design guide of thermal resistance down to 30% for 3D multi-stack devices , 2017, 2017 International Conference on Electronics Packaging (ICEP).

[6]  Nam-Seog Kim,et al.  Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages , 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

[7]  Koji Sakui,et al.  Vertically Replaceable Memory Block Architecture for Stacked DRAM Systems by Wafer-on-Wafer (WOW) Technology , 2020, IEEE Transactions on Electron Devices.

[8]  Yuchul Hwang,et al.  Chip package interaction in micro bump and TSV structure , 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.