Online Condition Monitoring for Bond Wire Degradation of IGBT Modules in Three-Level Neutral-Point-Clamped Converters

In this article, an online condition monitoring (CM) method is proposed for the bond wire degradation of insulated-gate bipolar transistor (IGBT) modules in a single-phase or three-phase three-level neutral-point-clamped (3LNPC) dc–ac, ac–dc converter. The proposed method has the ability to detect the whole IGBTs in a 3LNPC converter, based on finding the idle on-state IGBTs under the specific load current direction and switching sequence of a leg. The detection time is short (0.2 ms) and the influence of online CM on load current can be completely neglected as long as the insertion areas for CM test are chosen reasonably. Meanwhile, an advanced bond wire CM module is designed to conduct the CM test. This module can generate and inject the current pulse trains into IGBT modules, with the high current for CM test and low current for temperature-sensitive electrical parameter measurement, and sample the collector–emitter on-state voltage (VCE$\_$ON) stably and precisely. Finally, the experimental work was carried out to verify the effectiveness of the proposed method and the practicality of the developed CM module.

[1]  Frédéric Richardeau,et al.  Evaluation of $V_{\rm ce}$ Monitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling , 2013, IEEE Transactions on Industrial Electronics.

[2]  C. Basaran,et al.  Failure modes and FEM analysis of power electronic packaging , 2002 .

[3]  Liang Cheng,et al.  State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography , 2014, IEEE Transactions on Power Electronics.

[4]  Philippe Godignon,et al.  SiC Schottky Diodes for Harsh Environment Space Applications , 2011, IEEE Transactions on Industrial Electronics.

[5]  M. Ciappa,et al.  Reliability of High-Power IGBT Modules for Traction Applications , 2007, 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.

[6]  Xiong Du,et al.  Online Condition Monitoring for Both IGBT Module and DC-Link Capacitor of Power Converter Based on Short-Circuit Current Simultaneously , 2017, IEEE Transactions on Industrial Electronics.

[7]  A. Singh,et al.  Evaluation of Vce at Inflection Point for Monitoring Bond Wire Degradation in Discrete Packaged IGBTs , 2017, IEEE Transactions on Power Electronics.

[8]  Cristian Busca Modeling lifetime of high power IGBTs in wind power applications - An overview , 2011, 2011 IEEE International Symposium on Industrial Electronics.

[9]  Peter Tavner,et al.  Condition Monitoring for Device Reliability in Power Electronic Converters: A Review , 2010, IEEE Transactions on Power Electronics.

[10]  Uwe Scheuermann,et al.  Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the Vce(T)-measurement , 2009, 2009 13th European Conference on Power Electronics and Applications.

[11]  Bing Ji,et al.  In Situ Diagnostics and Prognostics of Wire Bonding Faults in IGBT Modules for Electric Vehicle Drives , 2013, IEEE Transactions on Power Electronics.

[12]  Bin Wu,et al.  Multilevel Voltage-Source-Converter Topologies for Industrial Medium-Voltage Drives , 2007, IEEE Transactions on Industrial Electronics.

[13]  Steffen Bernet,et al.  The active NPC converter and its loss-balancing control , 2005, IEEE Transactions on Industrial Electronics.

[14]  José R. Rodríguez,et al.  A Survey on Neutral-Point-Clamped Inverters , 2010, IEEE Transactions on Industrial Electronics.

[15]  C. S. Avant,et al.  Power cycling reliability of IGBT power modules , 1997, IAS '97. Conference Record of the 1997 IEEE Industry Applications Conference Thirty-Second IAS Annual Meeting.

[16]  Mounira Berkani,et al.  Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling , 2011, IEEE Transactions on Industrial Electronics.

[17]  Pengju Sun,et al.  Monitoring Potential Defects in an IGBT Module Based on Dynamic Changes of the Gate Current , 2013, IEEE Transactions on Power Electronics.

[18]  L.G. Franquelo,et al.  The age of multilevel converters arrives , 2008, IEEE Industrial Electronics Magazine.

[19]  D. G. Holmes,et al.  Optimal pulse width modulation for three-level inverters , 2003, IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03..

[20]  L. Dupont,et al.  Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters—A Review , 2012, IEEE Transactions on Power Electronics.

[21]  A. Morozumi,et al.  Reliability of power cycling for IGBT power semiconductor modules , 2001, Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248).

[22]  Du Mingxing,et al.  Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module , 2014, IEEE Transactions on Device and Materials Reliability.

[23]  Mingyao Ma,et al.  In-situ diagnostics and prognostics of wire bonding faults in IGBT modules of three-level neutral-point-clamped inverters , 2016, 2016 IEEE 8th International Power Electronics and Motion Control Conference (IPEMC-ECCE Asia).

[24]  Dawei Xiang,et al.  An Industry-Based Survey of Reliability in Power Electronic Converters , 2011, IEEE Transactions on Industry Applications.

[25]  Frede Blaabjerg,et al.  Advanced Accelerated Power Cycling Test for Reliability Investigation of Power Device Modules , 2016, IEEE Transactions on Power Electronics.

[26]  Mauro Ciappa,et al.  Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..

[27]  Bongtae Han,et al.  Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review , 2015, IEEE Transactions on Power Electronics.

[28]  Bo Wang,et al.  Condition Monitoring IGBT Module Bond Wires Fatigue Using Short-Circuit Current Identification , 2017, IEEE Transactions on Power Electronics.

[29]  Guy Lefranc,et al.  High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC , 2003, Microelectron. Reliab..

[30]  Mingwei Xu,et al.  Investigation of gate voltage oscillations in an IGBT module after partial bond wires lift-off , 2013, Microelectron. Reliab..

[31]  Min Zhang,et al.  A moving average filter based method of performance improvement for ultraviolet communication system , 2012, 2012 8th International Symposium on Communication Systems, Networks & Digital Signal Processing (CSNDSP).

[32]  Han Lei,et al.  Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During Thermosonic Flip–Chip Bonding , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.