Bonding mechanisms and electrical properties of Ge/Si and Si/Si bonded wafers achieved by thin microcrystalline Ge interlayer
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Rongfei Wang | Chong Wang | S. Ke | Jie Yang | Jianfei Chai | Yuan Huang | C. Tan | Feng Lin
暂无分享,去创建一个
Rongfei Wang | Chong Wang | S. Ke | Jie Yang | Jianfei Chai | Yuan Huang | C. Tan | Feng Lin