An integrated hybrid solver and measurements for EMI/EMC analysis of cables and PCBs enclosed within metallic structures

This paper presents an integrated hybrid solver and a series of measurements for the EMI/EMC analysis of complex metallic structures enclosing printed circuit boards (PCBs) and cables. The proposed solver integrates the previously validated numerical and analytical tools especially developed and optimized for simpler EMI/EMC coupling scenarios. Specifically, the solution algorithm employs the Telegrapher's Iterative Coupling Equations for Cables, Hybrid S parameters for PCBs and Semi-analytical Solutions based on Cavity Green's functions for Canonical Surrounding Structures. For validation, a multi- cavity structure was constructed and a series of measurements were carried out in an anechoic chamber to evaluate EMI coupling to cables and PCBs under various enclosure configurations. The measurement setup employed multiple rectangular and cylindrical cavities, penetrating wires and printed circuit boards. The proposed integrated solver, after validation, will be used as an efficient tool for investigating the EMI/EMC problems of real life complex platforms at system level.

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