论文信息 - Fabrication and packaging of inertia micro-switch using low-temperature photo-resist molded metal-electroplating technology

Fabrication and packaging of inertia micro-switch using low-temperature photo-resist molded metal-electroplating technology

Abstract Separate and non-interfering photo-resist molded metal-electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches were designed using a simple but accurate lumped spring-mass model. With the application of an anti-stiction hydrophobic coating, un-encapsulated switches making over 100 million contacts have been demonstrated in room ambient.

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