Atomic Layer Deposition of Ni Thin Films and Application to Area-Selective Deposition

Downlo Atomic Layer Deposition of Ni Thin Films and Application to Area-Selective Deposition Woo-Hee Kim, Han-Bo-Ram Lee, Kwang Heo, Young Kuk Lee, Taek-Mo Chung, Chang Gyoun Kim, Seunghun Hong, Jong Heo, and Hyungjun Kim* Department of Material Science and Engineering, Pohang University of Science and Technology, Pohang 790-784, Korea School of Electrical and Electronic Engineering, Yonsei University, Seoul 120-749, Korea Department of Physics and Astronomy and Interdisciplinary Program in Nano-Science and Technology, Seoul National University, Seoul 151-747, Korea Advanced Materials Division, Korea Research Institute of Chemical Technology, Daejeon 305-600, Korea

[1]  F. Prinz,et al.  Application of Atomic Layer Deposition of Platinum to Solid Oxide Fuel Cells , 2008 .

[2]  Hyunjun Yoo,et al.  Template-Directed Synthesis of Oxide Nanotubes: Fabrication, Characterization, and Applications† , 2008 .

[3]  J. Son,et al.  Ru nanostructure fabrication using an anodic aluminum oxide nanotemplate and highly conformal Ru atomic layer deposition , 2008, Nanotechnology.

[4]  M. Knez,et al.  Ferromagnetic nanotubes by atomic layer deposition in anodic alumina membranes , 2007 .

[5]  Jung-Hee Lee,et al.  Effectiveness of Self-Carbon and Titanium Capping Layers in NiSi formation with Ni Film Deposited by Atomic Layer Deposition , 2007 .

[6]  James R Engstrom,et al.  Effects of interfacial organic layers on thin film nucleation in atomic layer deposition , 2006 .

[7]  S. Bent,et al.  Highly stable monolayer resists for atomic layer deposition on germanium and silicon , 2006 .

[8]  M. Ritala,et al.  Self‐Assembled Octadecyltrimethoxysilane Monolayers Enabling Selective‐Area Atomic Layer Deposition of Iridium , 2006 .

[9]  M. Biesinger,et al.  New interpretations of XPS spectra of nickel metal and oxides , 2006 .

[10]  Kyungmin Kim,et al.  Formation of Low-Resistivity Nickel Silicide with High Temperature Stability from Atomic-Layer-Deposited Nickel Thin Film , 2006 .

[11]  Stacey F. Bent,et al.  Chemistry for Positive Pattern Transfer Using Area‐Selective Atomic Layer Deposition , 2006 .

[12]  Hyungjun Kim,et al.  The application of atomic layer deposition for metallization of 65 nm and beyond , 2006 .

[13]  S. Bent,et al.  Achieving area-selective atomic layer deposition on patterned substrates by selective surface modification , 2005 .

[14]  T. Gougousi,et al.  Microcontact patterning of ruthenium gate electrodes by selective area atomic layer deposition , 2005 .

[15]  S. Bent,et al.  Investigation of Self-Assembled Monolayer Resists for Hafnium Dioxide Atomic Layer Deposition , 2005 .

[16]  Paul C. McIntyre,et al.  Self-assembled monolayer resist for atomic layer deposition of HfO2 and ZrO2 high-κ gate dielectrics , 2004 .

[17]  M. Sung,et al.  Atomic Layer Deposition of Titanium Oxide on Self-Assembled-Monolayer-Coated Gold , 2004 .

[18]  M. Sung,et al.  A new patterning method using photocatalytic lithography and selective atomic layer deposition. , 2004, Journal of the American Chemical Society.

[19]  Hyungjun Kim,et al.  Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing , 2003 .

[20]  J. Kittl,et al.  Ni- and Co-based silicides for advanced CMOS applications , 2003 .

[21]  R. Gordon,et al.  Atomic layer deposition of transition metals , 2003, Nature materials.

[22]  M. Ritala,et al.  Ruthenium Thin Films Grown by Atomic Layer Deposition , 2003 .

[23]  Sang-Won Kang,et al.  Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide , 2002 .

[24]  Leena‐Sisko Johansson,et al.  Studies of metallic thin film growth in an atomic layer epitaxy reactor using M(acac)2 (M = Ni, cu, Pt) precursors , 2000 .

[25]  S. Tay,et al.  Spectroscopic ellipsometry investigation of silicide formation by rapid thermal process , 1999 .

[26]  D. Xu,et al.  Material aspects of nickel silicide for ULSI applications , 1998 .

[27]  T. Barr.  An ESCA study of the termination of the passivation of elemental metals , 1978 .

[28]  D. Pierce,et al.  Hot-electron scattering length by measurement of spin polarization , 1974 .

[29]  Seunghun Hong,et al.  High Quality Area-Selective Atomic Layer Deposition Co Using Ammonia Gas as a Reactant , 2010 .

[30]  Jung-Hee Lee,et al.  Effect of poly silicon thickness on the formation of Ni-FUSI gate by using atomic layer deposited nickel film , 2010 .

[31]  W. Stickle,et al.  Handbook of X-Ray Photoelectron Spectroscopy , 1992 .