论文信息 - High rate sputter deposition of TiO2 from TiO2−x target

High rate sputter deposition of TiO2 from TiO2−x target

Abstract A new sputter technique for high rate deposition of TiO2 was developed for applying to common planar magnetron sputter system. With this technique, using plasma sprayed TiO2−x targets and a sputter gas of a few percent of O2 diluted with Ar, TiO2 films are deposited with a high deposition rate efficiency (deposition rate per applied power density) being almost eight times larger than that of the conventional sputter method using Ti target and O2 sputter gas.

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