A Novel Design Methodology for Reducing Simultaneous Switching Noise Evaluated by a Differential-IBIS Structure
暂无分享,去创建一个
[1] I.S. Stievano,et al. Parametric macromodels of differential drivers and receivers , 2005, IEEE Transactions on Advanced Packaging.
[2] J. Choma,et al. Architecture and Implementation of a Low-Power LVDS Output Buffer for High-Speed Applications , 2006, IEEE Transactions on Circuits and Systems I: Regular Papers.
[3] Michel Renovell,et al. System-in-Package, a Combination of Challenges and Solutions , 2007, 12th IEEE European Test Symposium (ETS'07).
[4] A. Varma,et al. A new method to achieve improved accuracy with IBIS models , 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..
[5] Sungtek Kahng. A differential-signaling analysis with the decoupling-capacitor loaded rectangular power-bus by a fast calculation method , 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..
[6] Madhavan Swaminathan,et al. System level signal and power integrity analysis methodology for system-in-package applications , 2006, 2006 43rd ACM/IEEE Design Automation Conference.
[7] Jun Li,et al. Ground Bounce Noise Isolation with Power Plane Segmentation in System-in-Package (SiP) , 2007, 2007 International Conference on Microwave and Millimeter Wave Technology.
[8] Zhiping Yang,et al. Enhancement of IBIS modeling capability in simutanous switching noise (SSN) and other power integrity related simulations - proposal, implementation, and validation , 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..
[9] Eby G. Friedman,et al. Simultaneous switching noise in on-chip CMOS power distribution networks , 2002, IEEE Trans. Very Large Scale Integr. Syst..
[10] P. Franzon,et al. Simultaneous switching noise in IBIS models , 2004, 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559).
[11] Soo-Hyung Kim,et al. Effects of on-chip and off-chip decoupling capacitors on electromagnetic radiated emission , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
[12] Jun-Seok Park,et al. Analysis of coupling characteristics between transmission lines with a buried meshed-ground in LTCC-MCMs , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).
[13] Eby G. Friedman,et al. Decoupling capacitors for multi-voltage power distribution systems , 2006, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
[14] K. Ishibashi,et al. An on-chip active decoupling circuit to suppress crosstalk in deep-submicron CMOS mixed-signal SoCs , 2004, IEEE Journal of Solid-State Circuits.
[15] Hung-Wen Lu,et al. A digitized LVDS driver with simultaneous switching noise rejection , 2004, Proceedings of 2004 IEEE Asia-Pacific Conference on Advanced System Integrated Circuits.
[16] S. Wane,et al. Application of Integral Analysis Technique to Determine Signal- and Power Integrity of Advanced Packages , 2007, 2007 IEEE Electrical Performance of Electronic Packaging.
[17] M. Drissi,et al. An experimental procedure to derive reliable IBIS models , 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
[18] P. Rickert,et al. Cellular handset integration - SIP versus SOC , 2005, IEEE Journal of Solid-State Circuits.
[19] Joungho Kim,et al. Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications , 2006, IEEE Microwave and Wireless Components Letters.
[20] Chin-Hsing Chen,et al. Studying an approach solution of i/o buffer information specification (IBIS) model , 2007 .
[21] Jun Chen,et al. Efficient In-Package Decoupling Capacitor Optimization for I/O Power Integrity , 2007, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
[22] Resve A. Saleh,et al. Novel decoupling capacitor designs for sub-90nm CMOS technology , 2006, 7th International Symposium on Quality Electronic Design (ISQED'06).
[23] M. Swaminathan,et al. Efficient Simulation of Power/Ground Planes for SiP Applications , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
[24] Eby G. Friedman,et al. On-Chip Power Noise Reduction Techniques in High Performance SoC-Based Integrated Circuits , 2005, Proceedings 2005 IEEE International SOC Conference.
[25] Hong Shi,et al. Simultaneous switching noise in FPGA and structure ASIC devices, methodologies for analysis, modeling, and validation , 2006, 56th Electronic Components and Technology Conference 2006.
[26] Martin H. Graham,et al. Book Review: High-Speed Digital Design: A Handbook of Black Magic by Howard W. Johnson and Martin Graham: (Prentice-Hall, 1993) , 1993, CARN.
[27] Eby G. Friedman,et al. On-chip /spl Delta/I noise in the power distribution networks of high speed CMOS integrated circuits , 2000, Proceedings of 13th Annual IEEE International ASIC/SOC Conference (Cat. No.00TH8541).