Thermal Set-point Control of Camera for Positioning System

This paper considers thermal set-point control of a precision camera that aids in device placements on wafers for bonding and meets thermal growth constraints. The camera thermal system is approximated by decoupled First Order Plus Time Delay (FOPTD) sub-systems. PID controllers are designed through computer optimization and further enhanced using an active disturbance rejection controller (ADRC). Supporting setpoint control results are provided which indicate suitable control action by decoupled plant assumption and improved disturbance rejection by addition of ADRC.

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