최근에 전자 산업 분야에서 장치의 고용량을 구현 하기 위해 구동 drive IC의 선폭은 좁아지고 집적도는 증가하고 있다. 이러한 반도체, 전자 산업 분야의 초소형화, 고밀도화에 따라 FCCL(Flexible Copper Clad Laminate)의 표면 품질이 더욱 중요해 지고 있다. FCCL의 표면 결함으로는 돌기, 스크레치, 덴트 등이 있다. 특히 돌기가 표면에 존재할 경우 후속 공정에서 쇼트와 같은 불량을 유발할 수 있으며, 제품의 품질 저하를 야기 시킬 수 있다. 하지만 표면에 돌기가 존재한다 하더라도, 전해액의 레벨링 특성이 우수하다면 돌기의 성장을 막을 수 있다.평탄하고, 결함이 없는 도금표면을 얻기 위해서는 첨가제의 역할이 필수적이다. 평탄한 구리 표면을 형성하기 위해서 stock solution에 가속제, 억제제, 레벨러를 첨가하였다. 레벨러를 첨가하는 이유는 평탄한 표면을 얻고, 돌기의 형성을 억제하기 위함이다. 구리도금 표면 형상을 향상시키기 위한 레벨러로는 SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B),DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone)가 사용되었다. 도금 첨가제와 도금 조건의 변화를 통해 도금시레벨링 특성을 향상시키고,레벨링 특성 측정을 위해 니켈 인공돌기를 제작 한 후 레벨링 특성을 측정하였다.Abstract: In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtainthe higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper CladLaminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumpscause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of platingsolution is good, it does not develop significant bump.In this study, the leveling characteristics of additives are investigate d.The objective of study is to improve the leveling characteristic and reduce the surface step through additives and platingconditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order toform flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition ofleveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet),AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solutionto enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variationof additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps. Keywords: Copperelectroplating, FCCL, Leveler, Reflectance, Surface roughness
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