Analysis and Design of Three Dimensional Free Space Optoelectronic Switching Network
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[1] Piero Castoldi,et al. All-optical packet-switched interconnection network based on modular photonic digital processing , 2009, IET Commun..
[2] D.H. Albonesi,et al. On-Chip Copper-Based vs. Optical Interconnects: Delay Uncertainty, Latency, Power, and Bandwidth Density Comparative Predictions , 2006, 2006 International Interconnect Technology Conference.
[3] W. Bachtold,et al. Highly uniform vertical-cavity surface-emitting lasers integrated with microlens arrays , 2000, IEEE Photonics Technology Letters.
[4] Jack L. Jewell,et al. Thermal management of VCSEL-based optoelectronic modules , 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.
[5] S. Yu. Analysis and design of vertical cavity surface emitting lasers , 2003 .
[6] F. Chatenoud,et al. Modeling of quantum-well lasers with electro-opto-thermal interaction , 1995 .
[7] S H Lee,et al. Dual-scale topology optoelectronic processor. , 1991, Optics letters.
[8] Dawei Huang,et al. Analysis of free-space optical interconnects for the three-dimensional optoelectronic stacked processor , 2002 .
[9] Eby G. Friedman,et al. On-chip optical interconnect roadmap: challenges and critical directions , 2005 .
[10] Shigeru Kawai. Handbook of Optical Interconnects , 2005 .
[11] Xiaohua Ma,et al. Optical switching technology comparison: optical MEMS vs. other technologies , 2003, IEEE Commun. Mag..
[12] L. Chirovsky,et al. 16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit , 2000, IEEE Photonics Technology Letters.
[13] Ashok V. Krishnamoorthy,et al. Performance comparison between optoelectronic and VLSI multistage interconnection networks , 1991 .
[14] Hui Chen,et al. On-Chip Optical Interconnect Roadmap: Challenges and Critical Directions , 2005, IEEE Journal of Selected Topics in Quantum Electronics.
[15] S.C. Esener,et al. Implementation of optical interconnections for VLSI , 1987, IEEE Transactions on Electron Devices.
[16] Ashok V. Krishnamoorthy,et al. 16 16 VCSEL Array Flip-Chip Bonded to CMOS , 1999 .
[17] MaXiaohua,et al. Optical switching technology comparison , 2003 .
[18] Guoqiang Li,et al. Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks. , 2002, Applied optics.
[19] D. Albonesi,et al. On-Chip Copper-Based vs. Optical Interconnects: Delay Uncertainty, Latency, Power, and Bandwidth Density Comparative Predictions , 2006, 2006 International Interconnect Technology Conference.
[20] Yulei Zhang,et al. Performance Comparison and Overview of Different Approaches for VLSI Optoelectronic Interconnects , 2010, IEEE/OSA Journal of Optical Communications and Networking.
[21] Larry A. Coldren,et al. Monolithic integration of substrate input/output resonant photodetectors and vertical-cavity lasers , 1999 .
[22] S C Esener,et al. Optical transpose interconnection system architectures. , 1993, Optics letters.
[23] Dan Botez,et al. Diode laser arrays , 2005, Optical Society of America Annual Meeting.
[24] John A. Neff. Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays , 1996, Photonics West.
[25] Zvonko G. Vranesic,et al. Fundamentals of Digital Logic with Verilog Design , 1999 .
[26] J. Ko,et al. Flip-chip bonded arrays of monolithically integrated, microlensed vertical-cavity lasers and resonant photodetectors , 1999, IEEE Photonics Technology Letters.
[27] Hamid Ahmadi,et al. A survey of modern high-performance switching techniques , 1989, IEEE J. Sel. Areas Commun..
[28] T. Ouchi. Thermal Analysis of Thin-Film Vertical-Cavity Surface-Emitting Lasers Using Finite Element Method , 2002 .