Compact thermal model of a three-phase IGBT inverter power module

A compact thermal model of a three-phase IGBT inverter power module utilised in most of variable speed drivers has been described in this paper. The compact thermal model equals to an electrical RC network model is assembled from thermal resistances and thermal capacitances so that it can be easily implemented in a circuit simulator. Transient thermal 3D finite element (FE) model of the IGBT module has been carried out using commercially available FLOTHERM software; the 3D simulation results are then utilised to extract the compact thermal network parameters of the IGBT power modular. Good agreement has been achieved between simulation and experimental measurement.

[1]  Petar Igic,et al.  Physically based compact device models for circuit modelling applications , 2001 .

[2]  P.A. Mawby,et al.  Dynamic electro-thermal physically based compact models of the power devices for device and circuit simulations , 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

[3]  W. Fichtner,et al.  Static and dynamic thermal characteristics of IGBT power modules , 1999, 11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312).

[4]  Allen R. Hefner,et al.  A dynamic electro-thermal model for the IGBT , 1992, Conference Record of the 1992 IEEE Industry Applications Society Annual Meeting.

[5]  Petar Igic,et al.  Thermal model of power semiconductor devices for electro-thermal circuit simulations , 2002, 2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595).

[6]  W. Fichtner,et al.  A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications , 2004, 2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs.

[7]  M. Velez-Reyes,et al.  Thermal component models for electro thermal analysis of multichip power modules , 2002, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344).