반도체 검사 장비의 ASIC 및 Socket board의 열전달 해석

Final inspection in semiconductor manufacturing process is a very important step for quality control and cost reduction. The inspection often includes environmental tests, and the heat release from the inspection equipment may sometimes lead to misjudgment. This study investigates the heat release and transfer of ASIC board and socket board used in the inspection process using computational fluid dynamics. The heat transfer characteristics for different configurations of the equipment were discussed to derive considerations to improve its design.