Magnetoresistance in electrodeposited Ni-Fe-Cu/Cu multilayers

Abstract Multilayers of NiFeCu/Cu have been electrodeposited from a single electrolyte onto polycrystalline (100) textured and (100) single crystal copper substrates. Bilayer thicknesses as low as 30 A have been achieved, as confirmed by X-ray diffraction. Room temperature magnetoresistance measurements show the presence of giant magnetoresistance (GMR) and an anisotropic magnetoresistance (AMR) component in the films.