Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

This paper presents the development of a nondestructive evaluation method for delamination detection in integrated circuit (IC) packages. The developed method allows for quantitative detection of sealant delamination between integrated heat sink (IHS) and substrate, which is considered a potential failure mechanism in IC packages. The proposed method is expected to overcome the destructive nature of most existing techniques, while maintaining low cost of development. The reported development consists of the following processes: First, flash thermographic analysis is investigated and shown to be incapable of detecting a realistic sealant delamination. Then, ultrasonic guided waves (UGWs) are used as the chosen interrogation method due to their sensitivity to small-size damage and structural thickness variations. The complexity of the received ultrasonic signals caused by the geometric heterogeneity is resolved using a time–frequency signal processing technique. The extracted ultrasonic information, including time-of-arrival (TOA) and amplitude of wave modes received from different sensing paths under multiple excitation frequencies, is then used to construct a feature space. A multivariate Gaussian model is implemented as an information fusion and delamination detection tool, which investigates the distribution of feature space including correlations between features. Results from the developed model are compared with two existing evaluation methods, including pullout force measurement and a delamination metric. The developed method is seen to possess a similar level of accuracy with a nondestructive nature.

[1]  A. Chattopadhyay,et al.  Operational Anomaly Detection in Flight Data Using a Multivariate Gaussian Mixture Model , 2018, Annual Conference of the PHM Society.

[2]  Danny J. Lohan,et al.  Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications , 2018, Journal of Thermal Science and Engineering Applications.

[3]  David Geiger,et al.  Package stacking in SMT for 3D PCB assembly , 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

[4]  William J. Greig,et al.  Integrated Circuit Packaging, Assembly and Interconnections , 2007 .

[5]  Aditi Chattopadhyay,et al.  A nondestructive evaluation and structural health monitoring framework for X-COR sandwich composites , 2018 .

[6]  Jianbo Yu,et al.  Fault Detection Using Principal Components-Based Gaussian Mixture Model for Semiconductor Manufacturing Processes , 2011, IEEE Transactions on Semiconductor Manufacturing.

[7]  Willem D. van Driel,et al.  Prediction of Delamination Related IC & Packaging Reliability Problems , 2005, Microelectron. Reliab..

[8]  Janez Trontelj,et al.  Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques , 2019, Journal of Electronic Packaging.

[9]  Xinjun Sheng,et al.  Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact , 2009, Microelectron. Reliab..

[10]  Michael Pecht,et al.  Electronic Packaging Materials and Their Properties , 1998 .

[11]  David Harvey,et al.  Microelectronic package characterisation using scanning acoustic microscopy , 2007 .

[12]  Paul A. Kohl,et al.  Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections , 2011 .

[13]  D. Vanderstraeten,et al.  Three-dimensional x-ray laminography as a tool for detection and characterization of BGA package defects , 2002 .

[14]  Walmir M. Caminhas,et al.  Fuzzy Multivariable Gaussian Evolving Approach for Fault Detection and Diagnosis , 2010, IPMU.

[15]  Kentaro Uesugi,et al.  Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects , 2011 .

[16]  Lin Ye,et al.  Guided Lamb waves for identification of damage in composite structures: A review , 2006 .

[17]  Vijay Subramanian,et al.  Mechanical Characterization of Thermal Interface Materials and Its Challenges , 2019, Journal of Electronic Packaging.

[18]  Tielin Shi,et al.  Using active thermography for defects inspection of flip chip , 2014, Microelectron. Reliab..

[19]  Chia-Pin Chiu,et al.  Cooling a Microprocessor Chip , 2006, Proceedings of the IEEE.

[20]  Bo Wan,et al.  Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition , 2019, Journal of Electronic Packaging.

[21]  Jing Liu,et al.  Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs , 2010 .

[22]  Ajay Raghavan,et al.  Guided-wave structural health monitoring , 2007 .

[23]  Aditi Chattopadhyay,et al.  Reference-free damage localization in time-space domain for structural health monitoring of X-COR sandwich composites , 2018, Journal of Intelligent Material Systems and Structures.

[24]  Jürgen Wilde,et al.  Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching , 2020 .

[25]  K. N. Tu,et al.  Reliability challenges in 3D IC packaging technology , 2011, Microelectron. Reliab..

[26]  Suresh V. Garimella,et al.  Error Reduction in Infrared Thermography by Multiframe Super-Resolution , 2018, Journal of Electronic Packaging.

[27]  C. Quate,et al.  Acoustic microscope—scanning version , 1974 .

[28]  Lin Ye,et al.  Lamb wave-based quantitative identification of delamination in CF/EP composite structures using artificial neural algorithm , 2004 .

[29]  Alice C. Kilgo,et al.  Gold-Tin Solder Wetting Behavior for Package Lid Seals , 2018 .

[30]  Youngjoon Suh,et al.  Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence , 2020 .

[31]  Stéphane Mallat,et al.  Matching pursuits with time-frequency dictionaries , 1993, IEEE Trans. Signal Process..

[32]  Amos Lapidoth,et al.  A Foundation In Digital Communication: Index , 2009 .

[33]  Aditi Chattopadhyay,et al.  Damage assessment of CFRP composites using a time–frequency approach , 2012 .

[34]  Aditi Chattopadhyay,et al.  A Reference-Free Guided Wave Based Damage Localization Approach for Highly Dispersive Structures , 2017 .

[35]  Aditi Chattopadhyay,et al.  Ultrasonic guided wave propagation in composites including damage using high-fidelity local interaction simulation , 2017 .

[36]  Jan M. Rabaey,et al.  Digital Integrated Circuits , 2003 .

[37]  Aditi Chattopadhyay,et al.  Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination , 2017 .

[38]  Aditi Chattopadhyay,et al.  Multi-dimensional signal processing and mode tracking approach for guided wave based damage localization in X-COR sandwich composite , 2018, Mechanical Systems and Signal Processing.