Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/Transparent Thin-film Electronics
暂无分享,去创建一个
Chi Hwan Lee | Jae-Han Kim | Taek-Soo Kim | Xiaolin Zheng | Chenyu Zou | In Sun Cho | Jeffery M. Weisse | William Nemeth | Qi Wang | Adri C. T. van Duin | A. V. van Duin | Chi Hwan Lee | Xiaolin Zheng | Taek‐Soo Kim | I. Cho | Jae-Han Kim | W. Nemeth | Chenyu Zou | Qi Wang
[1] Joseph C. Fogarty,et al. A reactive molecular dynamics simulation of the silica-water interface. , 2010, The Journal of chemical physics.
[2] Justin A. Blanco,et al. Dissolvable films of silk fibroin for ultrathin conformal bio-integrated electronics. , 2010, Nature materials.
[3] Myeong-Lok Seol,et al. Transfer of functional memory devices to any substrate , 2013 .
[4] Metin Sitti,et al. Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing , 2010, Proceedings of the National Academy of Sciences.
[5] John A Rogers,et al. Optimized structural designs for stretchable silicon integrated circuits. , 2009, Small.
[6] A. V. Duin,et al. Development and Validation of ReaxFF Reactive Force Field for Hydrocarbon Chemistry Catalyzed by Nickel , 2010 .
[7] Xiaolin Zheng,et al. Peel-and-Stick: Fabricating Thin Film Solar Cell on Universal Substrates , 2012, Scientific Reports.
[8] Xun Cai,et al. Effects of residual stresses on interfacial adhesion measurement , 2009 .
[9] Reinhold H. Dauskardt,et al. Moisture-assisted subcritical debonding of a polymer/metal interface , 2002 .
[10] A. V. Duin,et al. ReaxFF: A Reactive Force Field for Hydrocarbons , 2001 .
[11] Paolo Vavassori,et al. Flexible and stretchable polymers with embedded magnetic nanostructures. , 2013, Advanced materials.
[12] Xiaolin Zheng,et al. Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method. , 2011, Nano letters.
[13] Heung Cho Ko,et al. Arrays of silicon micro/nanostructures formed in suspended configurations for deterministic assembly using flat and roller-type stamps. , 2011, Small.
[14] J. Kollár,et al. The surface energy of metals , 1998 .
[15] R. Dauskardt,et al. Fracture of nanoporous thin-film glasses , 2004, Nature materials.
[16] B. Cho,et al. Direct measurement of adhesion energy of monolayer graphene as-grown on copper and its application to renewable transfer process. , 2012, Nano letters.
[17] R. Dauskardt,et al. Environmentally assisted debonding of copper/barrier interfaces , 2012 .
[18] Brian Litt,et al. Flexible, Foldable, Actively Multiplexed, High-Density Electrode Array for Mapping Brain Activity in vivo , 2011, Nature Neuroscience.
[19] Yonggang Huang,et al. Transfer printing by kinetic control of adhesion to an elastomeric stamp , 2006 .
[20] Stephen W. Freiman,et al. A molecular interpretation of stress corrosion in silica , 1982, Nature.
[21] S. Wiederhorn. Moisture assisted crack growth in ceramics , 1968 .
[22] John A Rogers,et al. Imbricate scales as a design construct for microsystem technologies. , 2012, Small.
[23] Xiaolin Zheng,et al. Fabricating nanowire devices on diverse substrates by simple transfer-printing methods , 2010, Proceedings of the National Academy of Sciences.
[24] Huanyu Cheng,et al. A Physically Transient Form of Silicon Electronics , 2012, Science.
[25] Audrey M. Bowen,et al. Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication , 2012, Advanced materials.
[26] R. M. Cannon,et al. On the physics of moisture-induced cracking in metal-glass (copper-silica) interfaces , 2007 .
[27] Dirk C. Keene. Acknowledgements , 1975 .
[28] Sheldon M. Wiederhorn,et al. Influence of Water Vapor on Crack Propagation in Soda‐Lime Glass , 1967 .
[29] J. Rogers,et al. GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies , 2010, Nature.
[30] M. Kanatzidis,et al. Low-temperature fabrication of high-performance metal oxide thin-film electronics via combustion processing. , 2011, Nature materials.