Notebook PC 냉각용 소형 히트파이프 성능 시험 연구

The present study was to investigate problems related to cooling of a micro processor in a notebook PC by using miniature heat pipe. For 12 miniature heat pipes with 3 different wick structure, respectively, a performance test was conducted to measure wall temperature distributions and thermal resistance. For most of the tested heat pipes, the heat transport capability was high enough to transfer a heat up to 12W. A value of thermal resistance rested in the range of 0.2~0.8℃/W. But in 2~3 cases, a temperature rise at the evaporator end was observed, indicating a partial dryout at heat loads over 9W. But the measured values of vapor temperature were unexpectedly high, ranging from 60 to 120℃. This phenomenon seemed to be caused by a poor contact structure at the level of condenser wall that is in contact with a cooling plate of steel, resulting a relatively high contact resistance of 3~l0℃ ㎡/W.