An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
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Shang-Lin Wu | Ching-Te Chuang | Wei Hwang | Yu-Chieh Huang | Yu-Chen Hu | Po-Tsang Huang | Jin-Chern Chiou | Yu-Tao Yang | Yen-Han Lin | Kuan-Neng Chen | Yan-Huei You | Jeng-Ren Duann | Tzai-Wen Chiu | Hsiao-Chun Chang | Jr-Ming Chen | Yan-Yu Huang
[1] Shang-Lin Wu,et al. A TSV-Based Bio-Signal Package With $\mu$ -Probe Array , 2014, IEEE Electron Device Letters.
[2] J.P. Donoghue,et al. Reliability of signals from a chronically implanted, silicon-based electrode array in non-human primate primary motor cortex , 2005, IEEE Transactions on Neural Systems and Rehabilitation Engineering.
[3] Daryl R. Kipke,et al. Wireless implantable microsystems: high-density electronic interfaces to the nervous system , 2004, Proceedings of the IEEE.
[4] N. Logothetis,et al. Neurophysiological investigation of the basis of the fMRI signal , 2001, Nature.
[5] Sang-Hoon Lee,et al. Interconnection of Multichannel Polyimide Electrodes Using Anisotropic Conductive Films (ACFs) for Biomedical Applications , 2011, IEEE Transactions on Biomedical Engineering.
[6] R. Oostenveld,et al. A MEMS-based flexible multichannel ECoG-electrode array , 2009, Journal of neural engineering.
[7] Ming Yin,et al. Listening to Brain Microcircuits for Interfacing With External World—Progress in Wireless Implantable Microelectronic Neuroengineering Devices , 2010, Proceedings of the IEEE.
[8] Mohamad Sawan,et al. A Mixed-Signal Multichip Neural Recording Interface With Bandwidth Reduction , 2009, IEEE Transactions on Biomedical Circuits and Systems.
[9] Shang-Lin Wu,et al. Through-silicon-via-based double-side integrated microsystem for neural sensing applications , 2013, 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers.
[10] Brian Litt,et al. Flexible, Foldable, Actively Multiplexed, High-Density Electrode Array for Mapping Brain Activity in vivo , 2011, Nature Neuroscience.
[11] K. Najafi,et al. A Wireless Implantable Microsystem for Multichannel Neural Recording , 2009, IEEE Transactions on Microwave Theory and Techniques.
[12] Shang-Lin Wu,et al. An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes , 2016, 2016 IEEE International Symposium on Circuits and Systems (ISCAS).