Embedded IC packaging technology for ultra-thin and highly compact RF module

In this paper. we present a novel ultra-compact embedded IC integration approach for System-On-Package (SOP) based solutions for RF and wireless conununication applications. Tlus concept is applied to the integration of a Ku band VCO module. The module fabrication is described and the impact of the packaging on the chip-set perfonimces is discussed. The final thickness of the module is the tlu~cst reported till date and is about only I50 win. The embedded VCO exhibits an oscillation frequency of 15.4 GHz, a phase noise of -99.2 dBcMz at a 1 MHz offset and inaxinnnn output power of 10.67 dBm. Multi-layer interconnects built with inodified MCM-D technology using advanced photosensitive cpoy InteniaT"8000 is described. We also present a detailed chmcterization and inodeling of RF inductors. They exhibit a quality factor as high as