论文信息 - Hybrid integration technologies for optical micro-systems

Hybrid integration technologies for optical micro-systems

Flip-chip bonding of various optical components on a silicon substrate by passive optical alignment, which eliminates complicated optical axis precise alignment, has opened up many new possibilities in constructing highly functional, reliable, and low-cost optical micro-systems. Using this technique several micro-sensors have been developed. Moreover, for future optical micro-systems, a novel method of a low temperature flip-chip bonding using surface activated bonding process has been introduced.

Tadatomo Suga | Renshi Sawada | Eiji Higurashi | T. Itoh

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