Three-dimensional CAE of wire-sweep in microchip encapsulation

Wire Sweep is a common molding problem encountered in microchip encapsulation. The resin melt flow will exert drag force on wires and hence causes deformation of wires. In this paper, an integrated CAE of wire sweep is proposed to help engineer to evaluate and optimize the encapsulation process. The resin flow is calculated by a true 3D thermal flow solver based on a highly flexible prismatic element generation technique. Thanks to the efficiency of the proposed methodology in terms of CPU time and memory requirement, the industrial packages with complex geometry and high pin count can be analyzed with minimum model simplification. Furthermore, a user-friendly integrated environment is also developed to link the flow analysis with structure analysis to provide the total solution for wire sweep assessment. The developed approach proved from numerical experiments to be a cost-effective method for true 3D simulation of wire sweep in microchip encapsulation.