Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias

A fast convolution-based technique, deemed Power Blurring, is demonstrated for thermal analysis of 3D ICs, including thermal vias. The temperature resulting from any power may in each layer of the chip can be computed without the need to re-mesh the whole structure. The maximum error in estimation time is reduced by a factor of 76× compared to finite element software.

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