Effect of aging on the growth of intermetallic compounds at the interface of Sn–9Zn–xAg/Cu substrates
暂无分享,去创建一个
[1] K. Bae,et al. Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints , 2002 .
[2] D. R. Frear,et al. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu , 2002 .
[3] K. Matsushige,et al. Strength of bonding interface in lead-free Sn alloy solders , 2001 .
[4] Le Luo,et al. Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging , 2001 .
[5] Min-Hsiung Hon,et al. Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface , 2001 .
[6] M. Hon,et al. Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate , 2000 .
[7] Paul Harris,et al. The role of intermetallic compounds in lead‐free soldering , 1998 .
[8] K. Suganuma,et al. Microstructure and Strength of Interface between Sn-Ag Eutectic Solder and Cu , 1995 .
[9] M. Mccormack,et al. Improved mechanical properties in new, Pb-free solder alloys , 1994 .
[10] D. R. Frear,et al. Solder mechanics : a state of the art assessment , 1991 .