Fabrication technology for silicon-based microprobe arrays used in acute and sub-chronic neural recording

This work presents a new fabrication technology for silicon-based neural probe devices and their assembly into two-dimensional (2D) as well as three-dimensional (3D) microprobe arrays for neural recording. The fabrication is based on robust double-sided deep reactive ion etching of standard silicon wafers and allows full 3D control of the probe geometry. Wafer level electroplating of gold pads was performed to improve the 3D assembly into a platform. Lithography-based probe-tracking features for quality management were introduced. Probes for two different assembly methods, namely direct bonding to a flexible micro-cable and platform-based out-of-plane interconnection, were produced. Systems for acute and sub-chronic recordings were assembled and characterized. Recordings from rats demonstrated the recording capability of these devices.

[1]  Patrick Merken,et al.  The NeuroProbes project: A concept for electronic depth control , 2008, 2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society.

[2]  Mechanical Characterization of Thin-Film Composites using the Load-Deflection Response of Multilayer Membranes - Elastic and Fracture Properties , 2007 .

[3]  Stanislav Herwik,et al.  The NeuroProbes Project - Multifunctional Probe Arrays for Neural Recording and Stimulation , 2008 .

[4]  R.J. Vetter,et al.  Development of a Microscale Implantable Neural Interface (MINI) Probe System , 2005, 2005 IEEE Engineering in Medicine and Biology 27th Annual Conference.

[5]  Qing Bai,et al.  A high-yield microassembly structure for three-dimensional microelectrode arrays , 2000, IEEE Transactions on Biomedical Engineering.

[6]  M. Koudelka-Hep,et al.  Development and Characterization of Choline and L-Glutamate Biosensor Integrated on Silicon Microprobes for In-Vivo Monitoring , 2007, 2007 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society.

[8]  E. M. Schmidt,et al.  Electrodes for Many Single Neuron Recordings , 1998 .

[9]  K.D. Wise,et al.  Ultra-Compact Integration for Fully-Implantable Neural Microsystems , 2009, 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.

[10]  T. Stieglitz,et al.  CMOS-Based High-Density Silicon Microprobe Array for Electronic Depth Control in Neural Recording , 2009, 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.

[11]  R. Andersen,et al.  A New Multi-Site Probe Array with Monolithically Integrated Parylene Flexible Cable for Neural Prostheses , 2005, 2005 IEEE Engineering in Medicine and Biology 27th Annual Conference.

[12]  O. Paul,et al.  Reliability of MEMS Materials: Mechanical Characterization of Thin-Films using the Wafer Scale Bulge Test and Improved Microtensile Techniques , 2007 .

[13]  T Stieglitz,et al.  Hybrid microprobes for chronic implantation in the cerebral cortex , 2008, 2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society.

[14]  István Ulbert,et al.  Multiple microelectrode-recording system for human intracortical applications , 2001, Journal of Neuroscience Methods.

[15]  Luke P. Lee,et al.  Implantable multichannel electrode array based on SOI technology , 2003 .

[16]  Roland Zengerle,et al.  Robust microprobe systems for simultaneous neural recording and drug delivery , 2009 .

[17]  U. Hofmann,et al.  Institute of Physics Publishing Journal of Micromechanics and Microengineering a 32-site Neural Recording Probe Fabricated by Drie of Soi Substrates , 2022 .

[18]  K. Horch,et al.  A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array , 1991, IEEE Transactions on Biomedical Engineering.

[19]  C. Van Hoof,et al.  A 3D slim-base probe array for in vivo recorded neuron activity , 2008, 2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society.

[20]  K. Wise,et al.  An integrated-circuit approach to extracellular microelectrodes. , 1970, IEEE transactions on bio-medical engineering.

[21]  Ying Yao,et al.  A Microassembled Low-Profile Three-Dimensional Microelectrode Array for Neural Prosthesis Applications , 2007, Journal of Microelectromechanical Systems.

[22]  K. Wise,et al.  A high-yield IC-compatible multichannel recording array , 1985, IEEE Transactions on Electron Devices.

[23]  T. Stieglitz,et al.  High density interconnects and flexible hybrid assemblies for active biomedical implants , 2001 .

[24]  R.R. Harrison,et al.  A Low-Power Integrated Circuit for a Wireless 100-Electrode Neural Recording System , 2006, IEEE Journal of Solid-State Circuits.