Study on subsurface microcrack damage depth of diamond wire as-sawn sapphire crystal wafers

[1]  Xinying Li,et al.  Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing , 2022, Engineering Fracture Mechanics.

[2]  Yufei Gao,et al.  Analysis of sawing characteristics of fine diamond wire slicing multicrystalline silicon , 2021, Diamond and Related Materials.

[3]  Sheng Huang,et al.  Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing , 2021, Engineering Fracture Mechanics.

[4]  Yufei Gao,et al.  Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle , 2021 .

[5]  Lei Zhang,et al.  Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw , 2021 .

[6]  Lei Zhang,et al.  Research on material removal mechanism and radial cracks during scribing single crystal gallium nitride , 2021 .

[7]  Xipeng Xu,et al.  Molecular dynamics simulation of nanoindentation on c-plane sapphire , 2020 .

[8]  W. Weingaertner,et al.  Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw , 2020 .

[9]  M. Kuna,et al.  Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon , 2020 .

[10]  Xinying Li,et al.  Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal , 2020 .

[11]  Xinying Li,et al.  Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw , 2020 .

[12]  Xipeng Xu,et al.  Research on the machinability of A-plane sapphire under diamond wire sawing in different sawing directions , 2019, Ceramics International.

[13]  Lei Zhang,et al.  Nucleation location and propagation direction of radial and median cracks for brittle material in scratching , 2019, Ceramics International.

[14]  Xipeng Xu,et al.  Study on mechanism of crack propagation of sapphire single crystals of four different orientations under impact load and static load , 2019, Ceramics International.

[15]  Lei Zhang,et al.  Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal , 2018, Ceramics International.

[16]  Chao-Chang A. Chen,et al.  Study on diamond wire wear, surface quality, and subsurface damage during multi-wire slicing of c-plane sapphire wafer , 2018, The International Journal of Advanced Manufacturing Technology.

[17]  Xipeng Xu,et al.  The mechanical response characteristics of sapphire under dynamic and quasi-static indentation loading , 2018, Ceramics International.

[18]  Xipeng Xu,et al.  Research on the dynamic mechanical properties of C-plane sapphire under impact loading , 2018, Ceramics International.

[19]  Suk Bum Kwon,et al.  Study of stress intensity factor on the anisotropic machining behavior of single crystal sapphire , 2018 .

[20]  Xipeng Xu,et al.  Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire , 2017 .

[21]  S. Melkote,et al.  Effect of grit shape and crystal structure on damage in diamond wire scribing of silicon , 2017 .

[22]  Shreyes N. Melkote,et al.  Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers , 2016 .

[23]  Annemarie Falke,et al.  Determination of the impact of the wire velocity on the surface damage of diamond wire sawn silicon wafers , 2015 .

[24]  Sindy Würzner,et al.  Surface damage and mechanical strength of silicon wafers , 2015 .

[25]  C. Chung,et al.  Generation of diamond wire sliced wafer surface based on the distribution of diamond grits , 2014 .

[26]  Pingfa Feng,et al.  Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter , 2013 .

[27]  Meinhard Kuna,et al.  A macroscopic mechanical model of the wire sawing process , 2011 .

[28]  J. Schoenung,et al.  Investigation into the microstructure evolution caused by nanoscratch-induced room temperature deformation in M-plane sapphire , 2011 .

[29]  Chuanzhen Huang,et al.  Experimental study on abrasive waterjet polishing for hard–brittle materials , 2009 .

[30]  Spandan Maiti,et al.  A New Analytical Model for Estimation of Scratch‐Induced Damage in Brittle Solids , 2007 .

[31]  Jun'ichi Tamaki,et al.  Three-Dimensional Shape Modeling of Diamond Abrasive Grains Measured by a Scanning Laser Microscope , 2003 .

[32]  A. Evans,et al.  Elastic/Plastic Indentation Damage in Ceramics: The Lateral Crack System , 1982 .

[33]  A. Evans,et al.  Elastic/Plastic Indentation Damage in Ceramics: The Median/Radial Crack System , 1980 .