Advanced low cost manufacturing from CMP service

CMP aims at providing universities, research laboratories and industries with the facility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are provided for CMOS double layer poly/double layer metal (DLP/DLM) 0.8 /spl mu/m, DLM/TLM 0.6 /spl mu/m, DLP/4LM 0.35 /spl mu/m, SLP/6LM 0.25 /spl mu/m, BiCMOS DLP/DLM 0.8 /spl mu/m and 0.6 /spl mu/m, SiGe HBT 0.8 /spl mu/m DLP/DLM, and GaAs HEMT 0.2 /spl mu/m about 40 multi-project runs are offered per year. Microelectromechanical systems (MEMS) are provided in standard CMP runs in CMOS DLP/DLM 0.8/spl mu/m, BiCMOS DLP/DLM 0.8 /spl mu/m and HEMT GaAs 0.2 /spl mu/m, using compatible front-side bulk micro-machining MUMPS process is offered as a surface micro-machining allowing the integration of MEMS only microstructures. Finally, the main processes for multi-chip modules (MCMs) are also accessible through CMP.