A time‐domain approach for wideband modeling of electronic packages

This article presents a technique for wideband modeling and characterization of electronic packages. The modeling approach presented is based on time-domain reflectometry techniques (TDRs). The time-domain approach is capable of directly identifying the various contributions (reflections) from different discontinuities of the structure with a relatively high spatial resolution. Consequently, this makes it possible to isolate the effect of different discontinuities over the bandwidth of the package. This technique has been successfully applied to several packages, two of which are demonstrated in this article. © 2005 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2005.