Design of chip-type bandpass filter fabricated by LTCC

In the RF wireless communication systems, high-performance, low-loss and compact size are the trends of passive integrated components. LTCC technology, as a novel multi-layer ceramic technology, with its high performance, high integration, high stability and low cost, has drawn wide attention in recent years. A fourth-order Chebyshev chip-type bandpass filter with a reasonable structure and stable performance is designed in this paper.