Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects

Mechanically Flexible Interconnects (MFIs) with a pitch of 50 μm and a standoff height of 65 μm are reported. Mechanical characterization of the MFIs using indentation demonstrates elastic deformation and the feasibility of temporary interconnection. The integration of MFIs and TSVs is also reported along with electrical testing for interposer and 3D IC applications.

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