Poly-Si Thin-Film Transistors: An Efficient and Low-Cost Option for Digital Operation

In this paper, we propose an optimization methodology to design low-temperature polycrystalline-silicon thin-film transistors (LTPS TFTs) for submicrometer ultralow-power digital operation. LTPS TFTs incur low fabrication cost and can be fabricated on a variety of substrates (flexible such as polymer, glass, etc.). LTPS TFT has significantly reduced mobility, resulting in reduced driving current; however, we show that, for ultralow-power subthreshold operation (Vdd < Vth) , LTPS TFTs can be optimized to achieve comparable performance as a single-crystalline silicon (c-Si) silicon-on-insulator (SOI). For LTPS TFTs with TS1 < 10 nm , ring oscillators (operating in subthreshold region) show significant reduction in intrinsic delay when the midgap trap density gets properly controlled (< 1012 cm-2) after hydrogenation with less dynamic energy consumption under isostatic power consumption compared to a c-Si SOI MOSFET. We also address the inherent variations in grain boundaries at device and circuit levels to gain practical insights.

[1]  R. Iyer,et al.  Disilane-Based Low Thermal Budget Silicon Dioxide Chemical Vapor Deposition Process in a Single-Wafer Chamber , 2006 .

[2]  Shigeyasu Uno,et al.  Simulation Study of the Dependence of Submicron Polysilicon Thin-Film Transistor Output Characteristics on Grain Boundary Position , 2005 .

[3]  A. Orouji,et al.  A new poly-Si TG-TFT with diminished pseudosubthreshold region: theoretical investigation and analysis , 2005, IEEE Transactions on Electron Devices.

[4]  B.C. Paul,et al.  Device optimization for digital subthreshold logic operation , 2005, IEEE Transactions on Electron Devices.

[5]  S. B. Herner,et al.  On the conduction mechanism in polycrystalline silicon thin-film transistors , 2004, IEEE Transactions on Electron Devices.

[6]  K. Roy,et al.  Device optimization for digital sub-threshold operation , 2004, Conference Digest [Includes 'Late News Papers' volume] Device Research Conference, 2004. 62nd DRC..

[7]  H. Mizuta,et al.  Improved off-current and subthreshold slope in aggressively scaled poly-Si TFTs with a single grain boundary in the channel , 2004, IEEE Transactions on Electron Devices.

[8]  N. Sano,et al.  Statistical study of subthreshold characteristics in polycrystalline silicon thin-film transistors , 2003 .

[9]  Mansun Chan,et al.  A SPICE model for thin-film transistors fabricated on grain-enhanced polysilicon film , 2003 .

[10]  Tsu-Jae King,et al.  Tunable work function molybdenum gate technology for FDSOI-CMOS , 2002, Digest. International Electron Devices Meeting,.

[11]  Mingxiang Wang,et al.  Characterization of an individual grain boundary in metal-induced laterally crystallized polycrystalline silicon thin-film devices , 2001 .

[12]  M. Chan,et al.  Effects of longitudinal and latitudinal grain boundaries on the performance of large-grain polysilicon MOSFET , 2001, IEEE Electron Device Letters.

[13]  Jean Brini,et al.  On-current modeling of large-grain polycrystalline silicon thin-film transistors , 2001 .

[14]  Ken Yamaguchi,et al.  Modeling and characterization of polycrystalline-silicon thin-film transistors with a channel-length comparable to a grain size , 2001 .

[15]  Mansun Chan,et al.  Super thin-film transistor with SOI CMOS performance formed by a novel grain enhancement method , 2000 .

[16]  K. Saraswat,et al.  Controlled two-step solid-phase crystallization for high-performance polysilicon TFT's , 1997, IEEE Electron Device Letters.

[17]  T. Sugii,et al.  Analytical threshold voltage model for short channel double-gate SOI MOSFETs , 1996 .

[18]  Yasuhiro Mochizuki,et al.  Inverse staggered poly-Si and amorphous Si double structure TFT's for LCD panels with peripheral driver circuits integration , 1996 .

[19]  H. Kong,et al.  TWO-DIMENSIONAL SIMULATION STUDY OF FIELD-EFFECT OPERATION IN UNDOPED POLY-SI THIN-FILM TRANSISTORS , 1995 .

[20]  T. Sugii,et al.  Analytical threshold voltage model for short channel n/sup +/-p/sup +/ double-gate SOI MOSFETs , 1995, 1995 IEEE International SOI Conference Proceedings.

[21]  Shunpei Yamazaki,et al.  Characteristics of polycrystalline-Si thin film transistors fabricated by excimer laser annealing method , 1994 .

[22]  Tan Fu Lei,et al.  Correlation of polysilicon thin-film transistor characteristics to defect states via thermal annealing , 1994 .

[23]  Kikuo Ono,et al.  An LCD addressed by a-Si:H TFTs with peripheral poly-Si TFT circuits , 1993, Proceedings of IEEE International Electron Devices Meeting.

[24]  K. F. Lee,et al.  Scaling the Si MOSFET: from bulk to SOI to bulk , 1992 .

[25]  T.-Y. Huang,et al.  Passivation kinetics of two types of defects in polysilicon TFT by plasma hydrogenation , 1991, IEEE Electron Device Letters.

[26]  Noriyoshi Yamauchi,et al.  Polysilicon thin-film transistors with channel length and width comparable to or smaller than the grain size of the thin film , 1991 .

[27]  K. K. Young Short-channel effect in fully depleted SOI MOSFETs , 1989 .

[28]  G. Fortunato,et al.  Field-effect analysis for the determination of gap-state density and Fermi-level temperature dependence in polycrystalline silicon , 1988 .

[29]  H. Shichijo,et al.  Anomalous leakage current in LPCVD PolySilicon MOSFET's , 1985, IEEE Transactions on Electron Devices.

[30]  Warren B. Jackson,et al.  Density of gap states of silicon grain boundaries determined by optical absorption , 1983 .

[31]  P. J. Scanlon,et al.  Conductivity behavior in polycrystalline semiconductor thin film transistors , 1982 .