论文信息 - Low-cost TSH (through-silicon hole) interposers for 3D IC integration - 字舞流文

Low-cost TSH (through-silicon hole) interposers for 3D IC integration

M. Kao | W. Lo | J. Lau | C. Zhan | M. Dai | Y. Chao | R. Tain | Z. Hsiao | H. Fu | Yuan-Chang Lee | Ching-Kuan Lee | Sheng-Tsai Wu | H. Chien | C. Chien | Yu-wei Huang | Yu-Mei Cheng | L. Liao | Ren-Shin Cheng | Pai-Cheng Chang | W. Tsai