论文信息 - Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond - 字舞流文

Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond

S. Kannan | Shan Gao | R. S. Smith | J. Cho | E. Chua | H. Geisler | F. Kuechenmeister | Seungman Choi