In-line Optical Amplification for Silicon Photonics Platform by Flip-Chip Bonded InP-SOAs

We review the hybrid-integration of an InP semiconductor optical amplifier on a silicon photonics chip, and our in-line SOA integration using precise flip-chip bonding technology. We demonstrate the loss-less operation of a 4×4 switch with a 4ch-SOA array.

[1]  Masayuki Okuno,et al.  High-extinction ratio and low-loss silica-based 8/spl times/8 strictly nonblocking thermooptic matrix switch , 1999 .

[2]  K. Tanizawa,et al.  In-line optical amplification for Si waveguides on 1×8 splitter and selector by flip-chip bonded InP-SOAs , 2016, 2016 Optical Fiber Communications Conference and Exhibition (OFC).

[3]  N. Pleros,et al.  Dual SOA-MZI Wavelength Converters Based on III-V Hybrid Integration on a $\mu{\rm m}$-Scale Si Platform , 2014, IEEE Photonics Technology Letters.

[4]  Masayuki Okuno,et al.  High-Extinction Ratio and Low-Loss Silica-Based 8 8 Strictly Nonblocking Thermooptic , 1999 .

[5]  K Oyamada,et al.  Ultrahigh-Definition Video Transmission and Extremely Green Optical Networks for Future , 2011, IEEE Journal of Selected Topics in Quantum Electronics.

[6]  Ken Tanizawa,et al.  Broadband silicon photonics 8 × 8 switch based on double-Mach-Zehnder element switches. , 2017, Optics express.

[7]  Guang-Hua Duan,et al.  Hybrid III-V/silicon photonic integrated circuits for high bitrates telecommunication applications , 2017, OPTO.

[8]  Paolo Cardile,et al.  Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters. , 2016, Optics express.

[9]  Laurent Schares,et al.  A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain , 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).