Study and Analysis of Thermal-vibration Coupling Characteristics of Board Level Circuit Modules

Because of existence of coupling items,when solving thermal-vibration problems,temperature field cannot be solved independently and the complexity of problems will be increased.The paper deals with the difficulty of precise solving for coupling problems.Taking certain board level circuit module as example,its thermal-vibration coupling characteristics were analyzed by using ANASYS,software having powerful functions,and finite element methods.In analysis process,non-linear factors of material parameters′ changing with temperature were viewed and comparison with the analysis results of vibration without thermal effect was also accomplished.Through analysis and study,we can get that thermal effect can either increase the intrinsic frequency of board level circuit or reduce it;with the effects of temperature field,the modulus of elasticity will be reduced that can reduce intrinsic frequency consequently.While the effects of other material parameters on intrinsic frequency are different;with integrating effects of multi-factors,the conclusion was got that the intrinsic frequency of board level circuit will be reduced usually.