Thermal fatigue testing of thin metal films

An experimental method is described for performing thermal fatigue testing of thin films and lines on substrates. The method uses Joule heating from alternating currents to generate temperature, strain, and stress cycles in the metal structures. The apparatus has been installed in a scanning electron microscope and allows in situ observations of the fatigue damage evolution. First observations on Cu films reveal that fatigue damage forms in submicrometer thick films and is strongly affected by the film thickness and grain size. In addition, results from a special test structure confirm that the damage is caused by fatigue and not by electromigration.

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