论文信息 - RF balun embedded in multilayer organic substrate

RF balun embedded in multilayer organic substrate

This letter presents the design, modeling, and characterization of a RF balun embedded in multilayer organic substrate. A Marchand-type balun for 2.4-GHz Bluetooth and WLAN applications has been designed and fabricated using the low cost organic package technology. Its four-port measurement results show good electrical performance and close correlation with full-wave simulation data demonstrating the successful implementation of the RF passive component completely integrated in build-up layers of an organic package substrate. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 473–475, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22163

Kyu-Pyung Hwang | Jae‐Yong Ihm

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