Modelling of electromagnetic field coupling from ESD EMP to PCB

Printed circuit board(PCB) designers require fast and accurate methods of simulating immunity of PCB to electrostatic discharge(ESD) events to adequately predict and analyze ESD issues. An efficient methodology for calculating the electromagnetic field coupling from ESD electromagnetic pulse(EMP) to PCB while fully considering the non-linear circuit elements in the PCB core is proposed in this paper. Voltages and currents within the PCB are found by merging full-wave simulations of ESD EMP with a SPICE model of the PCB and the coupled electromagnetic energy. This method was verified through experiments, results show the promise of the method. This hybrid modelling method can significantly accelerate simulation time compared with traditional modelling techniques and can allow the designers to explore the variation in coupling that occurs with small changes in the test setup better, such as the position and orientation of the EMP and PCB pins.