Test structure definition for dummy metal filling strategy dedicated to advanced integrated RF inductors
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[1] C. Yue,et al. On-chip Spiral Inductors With Patterned Ground Shields For Si-based RF IC's , 1997, Symposium 1997 on VLSI Circuits.
[2] L.F. Tiemeijer,et al. Physics-based wideband predictive compact model for inductors with high amounts of dummy metal fill , 2006, IEEE Transactions on Microwave Theory and Techniques.
[3] Duane S. Boning,et al. PATTERN AND PROCESS DEPENDENCIES IN COPPER DAMASCENE CHEMICAL MECHANICAL POLISHING PROCESSES , 1998 .
[4] Torben Larsen,et al. Ground-shielded measuring technique for accurate on-wafer characterization of RF CMOS devices , 2000, ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095).
[5] Troels Emil Kolding. On-wafer calibration techniques for giga-hertz CMOS measurements , 1999, ICMTS 1999. Proceedings of 1999 International Conference on Microelectronic Test Structures (Cat. No.99CH36307).
[6] Andrew B. Kahng,et al. Filling algorithms and analyses for layout density control , 1999, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[7] Yong-Zhong Xiong,et al. Experimental Characterization of the Effect of Metal Dummy Fills on Spiral Inductors , 2007, 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium.