Dynamic Thermal Analysis of a Power Amplifier

This paper presents dynamic thermal analyses of a p ower amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results incl ude the cooling curves, the structure functions, the therma l time constant distribution and the Nyquist plot of the t hermal impedance. The experiments carried out demonstrated the influence of the contact resistance and the positio n of the entire cooling assembly on the obtained results.