Comparison of Model Order Reduction and Thermal Network Approaches in the Extraction of Dynamic Compact Thermal Models of LEDs

The Delphi4LED project is identifying methodologies for the extraction of multi-domain, electro-opto-thermal compact models of LED packages. The temperature dependent opto-electro model provides the thermal model with a thermal power dissipation, the thermal model provides the opto-electro model with a junction temperature. Together they are co-simulated to convergence whereupon both thermal and optical behaviour is predicted. Such models would be used by lighting designers to provide rapid indication of the performance of a proposed luminaire design. The thermal portion of the multi-domain model is required at least to provide temperature prediction of the chip junction and potentially phosphor and solder connection point temperatures. Equivalent thermal networks or reduced order models are both candidate approaches for the thermal model. This study will detail the extraction process for both, compare their performance and accuracy and discuss pros and cons regarding their possible adoption.

[1]  H. Vinke,et al.  A novel approach for the thermal characterization of electronic parts , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[2]  J.D. Parry,et al.  Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[3]  J. D. Parry,et al.  The world of thermal characterization according to DELPHI-Part I: Background to DELPHI , 1997 .

[4]  L. Codecasa,et al.  A novel approach for generating boundary condition independent compact dynamic thermal networks of packages , 2005, IEEE Transactions on Components and Packaging Technologies.

[5]  Alessandro Magnani,et al.  Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC) , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[6]  Najib Laraqi,et al.  Latest developments of compact thermal modeling of system-in-package devices by means of Genetic Algorithm , 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

[7]  L. Codecasa,et al.  Why matrix reduction is better than objective function based optimization in compact thermal model creation , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[8]  András Poppe,et al.  Simulation of LED based luminaires by using multi-domain compact models of LEDs and compact thermal models of their thermal environment , 2017, Microelectron. Reliab..

[9]  Andras Poppe,et al.  LED 3D thermal model calibration against measurement , 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

[10]  Robin Bornoff.  Extraction of Boundary Condition Independent Dynamic Compact Thermal Models of LEDs—A Delphi4LED Methodology , 2019 .