论文信息 - BCB Cap Packaging of MEMS Switches Integrated With 100- $\mu{\rm m}$ MMIC Wafer

BCB Cap Packaging of MEMS Switches Integrated With 100- $\mu{\rm m}$ MMIC Wafer

This paper presents benzocyclobutene (BCB) cap packaging of Microelectromechanical systems (MEMS) switches integrated with a thin monolithic microwave integrated circuit (MMIC) wafer. To prevent a possible breakage during BCB bonding process, the 100-μm-thick MMIC wafer is bonded to 680-μm-thick GaAs support before the release of MEMS switches. BCB cap packaging has been performed through BCB cap transfer technique based on antiadhesion monolayered Si carrier wafer. The thick GaAs support wafer has been separated by polymethyl methacrylate (PMMA) sacrificial etching through perforated access holes. The packaged MMIC wafer has been successfully diced using conventional dicing machine. The implemented BCB caps on the target MMIC have the height of 25 μm and the cavity of 12 μm for the housing of MEMS switches. The achieved success rate of BCB caps transfer is ~ 95%. The BCB cap packaging effect to microstrip line has been investigated through the S-parameters measurement before and after the packaging. In addition, the packaged MEMS switch shows the insertion loss of 0.7 dB, the return loss of 25 dB, and the isolation of 20 dB at 30 GHz.

[1] G. Abadal,et al. Integration of RF-MEMS resonators on submicrometric commercial CMOS technologies , 2009 .

[2] N. Rolland,et al. A theoretical and experimental study of the BCB thin-film cap zero-level package based on FEM simulations , 2010 .

[3] W. Simon,et al. Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology , 2010, The 40th European Microwave Conference.

[4] Elliott R. Brown,et al. RF-MEMS switches for reconfigurable integrated circuits , 1998 .

[5] A. Malczewski,et al. Impact of Humidity on Dielectric Charging in RF MEMS Capacitive Switches , 2009, IEEE Microwave and Wireless Components Letters.

[6] J. Oberhammer,et al. Sealing of adhesive bonded devices on wafer level , 2004 .

[7] N. Rolland,et al. Packaging methodology for RF devices using a BCB membrane transfer technique , 2006 .

[8] A. Jourdain,et al. Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices , 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).

[9] N. Rolland,et al. Design, Fabrication, and Measurement of Benzocyclobutene Polymer Zero-Level Packaging for Millimeter-Wave Applications , 2007, IEEE Transactions on Microwave Theory and Techniques.