Superior Retention of Low-Resistance State in Conductive Bridge Random Access Memory With Single Filament Formation

Data retention is one crucial reliability aspect of resistive random access memory (RRAM). The retention failure mechanism of the low-resistance state (LRS) for conductive bridge RAM is generally originated from the lateral diffusion of metal ions/atoms from the filament to its surrounding medium. In this letter, we proposed an effective method to improve the LRS retention by controlling the formation of the single filament. For a certain LRS, the effective surface area for metal ions/atoms diffusion in single filament is less than that of multi-filament. Thus, better LRS retention characteristics can be achieved by reducing the metal species diffusion. The validity of this method is verified by the superior retention characteristics of the LRS programmed by current mode, in comparison with voltage programming mode. The former tends to generate a single filament, while the later grows multi-filament. This letter provides a possible way to enhance the retention characteristics of RRAM.

[1]  N. Banno,et al.  Nonvolatile solid-electrolyte switch embedded into Cu interconnect , 2006, 2009 Symposium on VLSI Technology.

[2]  R. Dittmann,et al.  Redox‐Based Resistive Switching Memories – Nanoionic Mechanisms, Prospects, and Challenges , 2009, Advanced materials.

[3]  Daniele Ielmini,et al.  Filament diffusion model for simulating reset and retention processes in RRAM , 2011 .

[4]  Wei Wang,et al.  Improved Resistive Switching Uniformity in $ \hbox{Cu/HfO}_{2}/\hbox{Pt}$ Devices by Using Current Sweeping Mode , 2011, IEEE Electron Device Letters.

[5]  刘明,et al.  Improved Resistive Switching Uniformity in Cu/HfO2/Pt Devices by Using Current Sweeping Mode , 2011 .

[6]  Ajay Joshi,et al.  Design and Optimization of Nonvolatile Multibit 1T1R Resistive RAM , 2014, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[7]  J. Guy,et al.  Investigation of the physical mechanisms governing data-retention in down to 10nm nano-trench Al2O3/CuTeGe conductive bridge RAM (CBRAM) , 2013, 2013 IEEE International Electron Devices Meeting.

[8]  Wei Wang,et al.  Formation of multiple conductive filaments in the Cu/ZrO2:Cu/Pt device , 2009 .

[9]  T. Takagi,et al.  Conductive Filament Scaling of ${\rm TaO}_{\rm x}$ Bipolar ReRAM for Improving Data Retention Under Low Operation Current , 2013, IEEE Transactions on Electron Devices.

[10]  D. Kwong,et al.  Oxide-based RRAM: Physical based retention projection , 2010, 2010 Proceedings of the European Solid State Device Research Conference.

[11]  Qi Liu,et al.  Real‐Time Observation on Dynamic Growth/Dissolution of Conductive Filaments in Oxide‐Electrolyte‐Based ReRAM , 2012, Advanced materials.

[12]  Qi Liu,et al.  Uniformity Improvement in 1T1R RRAM With Gate Voltage Ramp Programming , 2014, IEEE Electron Device Letters.

[13]  R. Waser,et al.  Nanoionics-based resistive switching memories. , 2007, Nature materials.

[14]  W. Tsai,et al.  High-Performance Programmable Metallization Cell Memory With the Pyramid-Structured Electrode , 2013, IEEE Electron Device Letters.

[15]  S. Muraoka,et al.  Comprehensive understanding of conductive filament characteristics and retention properties for highly reliable ReRAM , 2013, 2013 Symposium on VLSI Technology.