Microscopic and macroscopic thermal contact resistances of pressed mechanical contacts

Contact heat transfer at mechanical pressed contacts between two materials is very important in many applications. There are two types of thermal contact resistance at the interface of two solids. One of them is due to the constriction of heat flow lines at the interface, commonly known as thermal contact resistance, and the engineering literature has extensively dealt with this macroscopic phenomenon. The other type of constriction resistance is instead microscopic in nature. If the characteristic dimension of the constriction becomes comparable to the mean free path of the heat carriers (i.e., electrons and phonons), then there is a ballistic component to the constriction resistance. For different materials on the two sides, thermal boundary resistance due to phonon acoustic mismatch and to electron-phonon interaction in the case of metals becomes important. Here a unified model is developed which bridges the gap between the macroscopic constriction resistance and the microscopic contact resistance for ...

[1]  Y. S. Touloukian.  Thermophysical properties of matter , 1970 .

[2]  Gang Chen,et al.  Theoretical phonon thermal conductivity of Si/Ge superlattice nanowires , 2004 .

[3]  E. Gmelin,et al.  REVIEW ARTICLE: Thermal boundary resistance of mechanical contacts between solids at sub-ambient temperatures , 1999 .

[4]  W Steckelmacher,et al.  Knudsen flow 75 years on: the current state of the art for flow of rarefied gases in tubes and systems , 1986 .

[5]  R. Schwall,et al.  Thermal conductance of Cu/Cu and Cu/Si interfaces from 85 K to 300 K , 1992 .

[6]  M. Yovanovich,et al.  Enhancement of Thermal Contact Conductance by Metallic Coatings: Theory and Experiment , 1985 .

[7]  C. Kittel.  Introduction to solid state physics , 1954 .

[8]  R. Pohl,et al.  Thermal boundary resistance , 1989 .

[9]  J. Ziman,et al.  In: Electrons and Phonons , 1961 .

[10]  A. Chiba,et al.  Vickers hardness properties of structural materials for superconducting magnet at cryogenic temperatures , 2001 .

[11]  K. Ramamurthi,et al.  Thermal contact conductance of pressed contacts at low temperatures , 2004 .

[12]  P. Wyder,et al.  The lattice thermal conductivity of very pure aluminium , 1978 .

[13]  A. Majumdar.  Microscale Heat Conduction in Dielectric Thin Films , 1993 .

[14]  J. M. Rowe,et al.  Crystal Dynamics of Copper , 1967 .

[15]  P. Klemens.  Thermal Conductivity and Lattice Vibrational Modes , 1958 .

[16]  A. Majumdar,et al.  Microscale energy transport , 1998 .

[17]  S. Chatterjee,et al.  Lattice thermal conductivity of some copper and silver alloys , 1970 .

[18]  Kenneth E. Goodson,et al.  Phonon scattering in silicon films with thickness of order 100 nm , 1999 .

[19]  G. Wexler,et al.  The size effect and the non-local Boltzmann transport equation in orifice and disk geometry , 1966 .

[20]  M. Cooper,et al.  Thermal contact conductance , 1969 .

[21]  A. Majumdar,et al.  Role of electron–phonon coupling in thermal conductance of metal–nonmetal interfaces , 2004 .

[22]  Gang Chen,et al.  Thermal conductivity and ballistic-phonon transport in the cross-plane direction of superlattices , 1998 .

[23]  Gang Chen,et al.  Thermal conductivity modeling of periodic two-dimensional nanocomposites , 2004 .

[24]  J. Maxwell.  A Treatise on Electricity and Magnetism , 1873, Nature.

[25]  H. Rosenberg.  The solid state , 1975 .

[26]  C. Madhusudana.  Thermal Contact Conductance , 1996 .

[27]  A. Majumdar,et al.  Nanoscale thermal transport , 2003, Journal of Applied Physics.

[28]  Leroy S. Fletcher,et al.  Thermal Contact Conductance of Adhesives for Microelectronic Systems , 1997 .

[29]  B. N. Brockhouse,et al.  Lattice Vibrations in Silicon and Germanium , 1959 .

[30]  I. Amdur,et al.  Kinetic Theory of Gases , 1959 .