论文信息 - Time-domain characterization and circuit modeling of a multilayer ceramic package

Time-domain characterization and circuit modeling of a multilayer ceramic package

The dynamic deconvolution (peeling algorithm) used in the past for single interconnects is extended to multiple-coupled interconnects and used to model high-speed electronic packages. A multilayer ceramic package (MLC) is used as vehicle to demonstrate the characterization and equivalent circuit modeling procedure based on single and multiport time-domain measurement.

V. K. Tripathi | J. M. Jong | B. Janko

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