Nanocomposites for Future Electronics Device Packaging: A Fundamental Study of Interfacial Connecting Mechanisms and Optimal Conditions of Silane Coupling Agents for Polydopamine-Graphene Fillers in Epoxy Polymers
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M. Kathaperumal | Jiaxiong Li | Jinho Hah | Zhijian Sun | Mingyue Zhang | C. Wong | Michael Yu | Ryan Wong | Lydia Mele